Micromax Automotive High Reliability Silver Adhesive
High-reliability adhesive for power modules
Automotive Adhesive Micromax "DA510" We handle pressure-type silver sintering bonding materials for high-reliability die attach and die top materials for SiC and GaN power semiconductors. DA510 is an adhesive that can be stored at room temperature and has excellent printability. It features a dense sintering surface achieved in a short time of 10 to 15 minutes at 250 to 280°C. Please feel free to contact us when you need assistance. 【Features】 ■ Silver sintering bonding material suitable for high-temperature operating power modules ■ High stability at room temperature allows for long continuous printing ■ Pressure-type bonding material enables short sintering times ■ Can be stored at room temperature *For more details, please refer to the PDF document or feel free to contact us.
- 企業：Micromax Electronic Material K. K.
- 価格：Other
